Qnity Powers the Industry’s Shift to Shrink and Stack at SEMICON Taiwan 2026

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Jon Kemp to deliver CEO Summit keynote as Qnity showcases the end-to-end materials platform making tomorrow's technologies possible

TAIPEI, Aug. 19, 2026 — Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions provider across the semiconductor value chain, will showcase its portfolio at SEMICON Taiwan, Sept. 2–4, 2026, at the Taipei Nangang Exhibition Center. Making its debut as an exhibitor at SEMICON Taiwan, Qnity will demonstrate how its materials innovation and integration expertise span the full stack, from the wafer and device level to system-level integration in advanced packages. Qnity will welcome customers, partners, industry leaders, and media at booth S7930 in the Materials Pavilion at TaiNEX 2.

“The future of semiconductor innovation depends on progress in both device scaling and advanced packaging,” said Kate Dei Cas, President of Semiconductor Technologies at Qnity. “Meeting the demands of the next generation of semiconductor technologies will require new levels of innovation and collaboration across the ecosystem. At SEMICON Taiwan, we'll engage with customers, partners and industry leaders on the opportunities and challenges ahead.”

Through technical presentations and product displays, Qnity will feature technologies that enable next-generation semiconductor manufacturing, supporting the growing demands of AI, high-performance computing, and advanced electronics. Highlights of Qnity's participation include:

  • A keynote presentation by Jon Kemp, Chief Executive Officer, titled "Shrink and Stack: Redefining Semiconductor Innovation in the Angstrom Era," on Sept. 2 at 11 a.m. at the Ecosystem Executive & CEO Summit.
  • Four technical presentations from Qnity experts spanning planarization, metallization, slurries, and advanced packaging as part of the IC Forum, Heterogeneous Integration Global Summit, Strategic Materials Conference, and TechXPOT. Attendees can learn how Qnity’s broad portfolio, deep technical expertise, and innovation leadership help customers address the challenges of AI-driven technology advancement and unlock the next generation of semiconductor performance.
  • A technology showcase featuring solutions for advanced semiconductor manufacturing, advanced packaging, and thermal management. Additionally, select materials innovations will be on display as part of SEMI’s Dream Fab at the entrance to TaiNEX 1.
  • Additional opportunities to engage with Qnity include meetings with company leaders and technical experts, hospitality events, and through SEMICON Taiwan's Guided Tour Program, which brings industry associations, students, government representatives, and international business delegations to participating exhibitor booths.

Building on more than 50 years of semiconductor materials innovation, Qnity partners with companies representing roughly 80% of the global semiconductor market. The company delivered 2025 net sales of approximately $4.75 billion and invests about 7% of net sales in research and development each year.

In Taiwan, Qnity is continuing to strengthen its local presence and customer proximity. Announced earlier this year, the company is investing $61.5 million in a new advanced semiconductor research and manufacturing facility in Hsinchu Science Park, placing development capability even closer to the customers it serves.

Customers and partners working on next-generation nodes, advanced packaging, and thermal challenges are invited to meet with the Qnity engineers and scientists who support these programs at booth S7930 in the Materials Pavilion at TaiNEX 2. To view the full agenda, learn more about Qnity’s activities at SEMICON Taiwan, and request a meeting, visitors are encouraged to explore Qnity’s virtual booth.

About Qnity
Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. More information about the company, its businesses and solutions can be found at www.qnityelectronics.com.

Qnity™, the Qnity Node Logo, and all products, unless otherwise noted, denoted with ™ or ® are trademarks, trade names or registered trademarks of affiliates of Qnity Electronics, Inc.

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Media Contact

Ashley Boucher
ashley.boucher@qnityelectronics.com

Winnie Chou
Winnie.chou@qnityelectronics.com

Released August 19, 2026